| 1 | ENGINEERING AND TECHNOLOGY | UNDER GRADUATE | MECHANICAL ENGINEERING | CADD LAB |
| 2 | ENGINEERING AND TECHNOLOGY | UNDER GRADUATE | FIRST YEAR/OTHER | CHEMISTRY |
| 3 | ENGINEERING AND TECHNOLOGY | UNDER GRADUATE | ELECTRICAL AND ELECTRONICS ENGINEERING | CONTROL SYSTEMS, ELECTRICAL MACHINES |
| 4 | ENGINEERING AND TECHNOLOGY | UNDER GRADUATE | MECHANICAL ENGINEERING | DYNAMICS LAB |
| 5 | ENGINEERING AND TECHNOLOGY | UNDER GRADUATE | ELECTRONICS & COMMUNICATION ENGG | ELECTRONICS, RF |
| 6 | ENGINEERING AND TECHNOLOGY | UNDER GRADUATE | FIRST YEAR/OTHER | EP LAB |
| 7 | ENGINEERING AND TECHNOLOGY | UNDER GRADUATE | CIVIL ENGINEERING | FLUID MECHANICS & HYDR.LAB |
| 8 | ENGINEERING AND TECHNOLOGY | UNDER GRADUATE | ELECTRICAL AND ELECTRONICS ENGINEERING | MEASUREMENTS & INST |
| 9 | ENGINEERING AND TECHNOLOGY | UNDER GRADUATE | MECHANICAL ENGINEERING | MECHATRONICS LAB |
| 10 | ENGINEERING AND TECHNOLOGY | UNDER GRADUATE | MECHANICAL ENGINEERING | METEROLOGY LAB |
| 11 | ENGINEERING AND TECHNOLOGY | UNDER GRADUATE | MECHANICAL ENGINEERING | MFT 1 & 2, STRENGTH OF MATERIALS |
| 12 | ENGINEERING AND TECHNOLOGY | UNDER GRADUATE | ELECTRONICS & COMMUNICATION ENGG | MICROWAVE, EDC, MICROPROCESSOR |
| 13 | ENGINEERING AND TECHNOLOGY | UNDER GRADUATE | COMPUTER SCIENCE AND ENGINEERING | MULTIMEDIA AND DATABASE LAB |
| 14 | ENGINEERING AND TECHNOLOGY | UNDER GRADUATE | ELECTRONICS & COMMUNICATION ENGG | NETWORK,EMBEDDED |
| 15 | ENGINEERING AND TECHNOLOGY | POST GRADUATE | POWER ELECTRONICS AND DRIVES | PG LAB |
| 16 | ENGINEERING AND TECHNOLOGY | UNDER GRADUATE | FIRST YEAR/OTHER | PHYSICS LAB |
| 17 | ENGINEERING AND TECHNOLOGY | UNDER GRADUATE | ELECTRICAL AND ELECTRONICS ENGINEERING | POWERELECTRONICS, ELECTRIC CIRCUITS |
| 18 | ENGINEERING AND TECHNOLOGY | POST GRADUATE | APPLIED ELECTRONICS | RESEARCH LAB |
| 19 | ENGINEERING AND TECHNOLOGY | UNDER GRADUATE | INFORMATION TECHNOLOGY | SIMULATION AND OS LAB |
| 20 | ENGINEERING AND TECHNOLOGY | UNDER GRADUATE | CIVIL ENGINEERING | SOIL MECHANCIS LAB |
